Tesa® 2.4 mil. Brown Amber Reactive Structural Bonding Film Tape (29 mm. x 200 m., 10 RL/CS)

The Tesa® 2.4 mil. Brown Amber Reactive Structural Bonding Film Tape (29 mm. x 200 m., 10 RL/CS) is the perfect solution for reliable chip modules and thermal-resistant material bonding. This film tape is activated by heat and pressure and has outstanding aging resistance with lifelong flexibility due to its high rubber content.

• Activated by heat and pressure for secure bonding
• 2.4 mil. thick
• Perfect for PVC ABS PET and PC cards
• Can bond thermal resistant materials such as metal glass plastic wood and textiles
• Has no backing for easy slitting and die cutting